深圳市通意达电子有限公司
地址: 深圳市南山区留仙大道创智云城A7栋10楼
电话: 86 - 755 - 86216033 - 202
传真: 86 - 755 - 86051857
网站: www.tyd-ele.com
邮件: nerrissa@tyd-ele.com
mark@tyd-ele.com
邮编:518000
Tflex CR200 is a two-part silicone-based thermal gap filler tha t has low viscosity prior to curing. Tflex CR200 is ideal for applications where large ga p tolerances are present. The low viscosity makes it ideal for applications in which the components cannot withstand high pressure during assembly. The mixed material will cure at room temperature or can be accelerated with the addition of heat. The Tflex CR200 composit ion provides excellent thermal performance and compliance.
Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. OPTIONS Available in 50 cc & 200 cc cartridges and 20 kg pail kits Available with or without beads (8 mils and 10 mils beads)
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