Tgon 800 Series

Electrically and Thermally Conductive Interface Pad

High-Performance, Cost Effective Thermal Interface Material

Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical contact and thermal transfer are desired.

 

Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis. Tgon 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut to specific configurations.

 

It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance.

STANDARD THICKNESSES 0.005” (0.13mm), 0.010” (0.25mm), 0.020” (0.51mm) Consult the factory for alternate thicknesses. Standard Sheet Size 18” x 24” (457mm x 609.6mm) Tgon™ 800 sheets are supplied with no liners when ordered without adhesive. With adhesive, they are supplied with no top liner and white release liner on the bottom. Tgon™ 800 is available on rolls and individual die cut shapes. Pressure Sensitive Adhesive Request no adhesive with “AO” suffix. Request adhesive on one side with “A1” suffix. Striped adhesive option on one side designated with SA. Double-sided adhesive is not available.

More Information：

http://www.tyd-ele.com/0/www.tyd-ele.com/upload/2019/11/21/2019112110036595.pdf