Tflex 300 Series

Thermal Gap Filler

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high
rate of compliancy allows the material to “totally blanket” the component, enhancing
thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.

 

Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance.
With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low
pressures.

 

Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of
parts that must slide together, such as a card into a chassis.

More Information：

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