TflexTM HD700 Series

Thermal Gap Filler

Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.

Tflex™ HD700 is available in thickness from 0.5mm (0.020") to 5mm (0.200"). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.

More Information：

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