Adding high-voltage, high-current 6.00mm right-angle pin assemblies and 6.00 and 8.00mm right-angle socket assemblies to the Sentrality Interconnect Family: Sentrality connector assemblies help mitigate tolerance stack-up issues that can cause misalignment, mechanical stress and mating difficulties. These problems hinder proper engagement, damage connectors and ultimately lead to failed electrical connections. Sentrality interconnects offer a dependable solution to overcome these challenges for excellent performance.
What makes this product different from the competition?
Sentrality Pin and Socket Interconnects’ self-aligning socket assemblies are designed to float between low-friction wave springs that allow them to self-align radially (360° freedom) +/- 1.00mm during mating. The tolerance stack-up issues that are significant customer concerns are mitigated by the product’s radial movement.
How does this product/solution create value for our customers?
Sentrality Pin and Socket Assemblies offer design flexibility with various sizes [3.40mm (75.0A), 6.00mm (120.0A), 8.00mm (200.0A) and 11.00mm (350.0A)] and transmit current between printed circuit boards and/or busbars with minimal heat generation at the contact interface.
What is the Molex advantage?
The Sentrality Interconnect System addresses customer’s high-current (75.0 to 350.0A) transmission needs between parallel boards and/or parallel busbars. Molex Sentrality products are suitable for customers in many diverse markets including data centers, base stations, alternative energy and battery storage and robotics.
Series: 220413, 220409, 205100
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